Model LO-S40 Scanning LASER MICRO perforation system, for 70µm to 200µm holes and pre-cuts
Description
This equipment is designed to make MICRO HOLES through laser sources on moving films of various materials and thicknesses and is to be inserted as a host unit in film processing lines, such as in slitters, extruders, packaging machines, printing and welding machines. The LO-S 40 ensures perfect micro holes even on multi-layer, single or bi-oriented laminated materials.
With the holes made by this unit, it is possible to control air exchange with the outside of the packages and induce CONTROLLED PERMEABILITY, thus increasing the SHELF LIFE of all fresh products. This procedure is widely used in food packages for IV and V RANGE, MAP and EMAP packages.
Through the use of of mirrors, this laser model makes it possible to make LONGITUDINAL AND CROSS PRE-CUTS, SCORING and MICRO-HOLES, and making SMALL SHAPES AND LOGOS on small surfaces.
Operation
The running film, held in perfect tension by the idler rollers, arrives at the device and is perforated by the CO2 LASER through the emission of BEAMS OF LIGHT WITH INFRARED FREQUENCY. These beams are "combed" and expanded through the beam expander, and their direction is controlled and directed through the use of MOTORIZED MIRRORS. Finally, the beams of light are focused on a circumscribed surface of the film by means of a FOCUSING LENS. Micro-perforation is achieved by sublimation of the material, caused by the heat of the laser beam.
Operation and Adjustment
OPERATION and ADJUSTMENT of the LO-S 40 is entrusted to our software with 4.0 readiness. From the electrical control panel, the operator, through a touch screen, manages all operations inherent to the device such as adjusting the laser pulses, diameter and position of the holes. The electronics are prepared with a PC through which the operator can control each scanning head and decide the perforation pattern.
With the laser, one can both MAKE HOLES and WEAKEN THE MATERIAL in depth, reducing the thickness of the film, without perforating it. This process, called SCORING, is ideal, for example, for creating easy openings.
Materials Processed
PE - LDPE - HDPE - PP - BOPP - CPP - PLA - NON WOVEN - LAMINATES - FOOD GRADE PVC
| TECHNICAL DATA SHEET | |
|---|---|
| Product | Scanning Laser perforation system |
| Number of laser sources installed | Minimum 1 laser source -> Maximum 6 laser sources |
| Hole Ø | Ø Min. 0,07mm - Ø Max. 0,2mm |
| Max Speed | 380* meters/minute |
| Software | 4.0 integration and recipe management (insertion, storage, recall) |
| Control system | Control panel with custom PLC and PC with remote assistance |
| Maximum power of the laser source | 360W* |
| Signal Resolution | 10 micro seconds |
| Pulse frequency | maximum frequency 30 kHz |
| Cooling System | Liquid |
| * | Value influenced by the type of processed material and machine configuration |
| OPTIONALS |
|---|
| Camera to automatically adjust the size and shape of holes |
| Fume Suction |
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